Semiconductor equipment companies, compared by process step
This table compares 48 semiconductor equipment companies by process step: lithography, deposition, etch, metrology, test and advanced packaging. 14 tie a named tool to AI or HBM chips. ASML lists 8 nm resolution on its High NA EXE with 13.5 nm EUV light, and Tokyo Electron cites 92% of coater/developers. Every figure links to its source.
Last verified
| Tools and product families | Wafer or ingot diametersmm | AI-relevant tools (detail) | Market share or position | Commercial or corporate status | ||||
|---|---|---|---|---|---|---|---|---|
| ACCRETECH (Tokyo Seimitsu) | Test and probing | Japan | AP3000/AP3000e production probers; UF2000 200 mm prober | UF2000: 200 | — | — | — | 2026-11-11 |
| ACM Research | Cleaning and CMP | United States | Ultra C SAPS II, V and VI | — | — | — | — | 2026-11-11 |
| Advantest | Test and probing | Japan | V93000 EXA Scale | — | V93000 for AI and high-performance compute devices | — | — | 2026-11-11 |
| AIXTRON | Deposition and thermal | Germany | G10-SiC Planetary Reactor | G10-SiC: 150 and 200 | — | — | — | 2026-11-11 |
| AMEC (Advanced Micro-Fabrication Equipment) | Etch and strip | China | Primo Twin-Star | Primo Twin-Star: 300 | — | — | — | 2026-11-11 |
| Applied Materials | Several steps | United States | Kinex hybrid bonder | — | Kinex, Xtera and PROVision 10 target GAA logic, HBM and advanced packaging for AI | — | Kinex used by leading-edge logic, memory and OSAT customers, announced 2025-10-07 | 2026-11-11 |
| ASM International | Deposition and thermal | Netherlands | Intrepid ES and ESA; Epsilon 2000; Previum preclean | Intrepid ES: 300; Epsilon 2000: 150 and 200 | — | Single-wafer ALD: more than 55% in 2024 (39% in 2018); leading-edge epitaxy: 25% in 2024 (12% in 2020) | — | 2026-11-11 |
| ASML | Lithography | Netherlands | NXE and EXE EUV systems | — | EUV lithography for chips used in artificial intelligence | — | — | 2026-11-11 |
| ASMPT | Packaging and assembly | Singapore | AMICRA NANO | — | TCB systems serve AI data-center packaging; memory-tool decisions linked to HBM4 rollouts (Q3 2026 disclosure) | — | — | 2026-11-11 |
| Axcelis Technologies | Ion implantation | United States | Purion H200 | Purion H200: silicon 200/300; SiC 150/200 | — | — | Merger with Veeco pending; China SAMR clearance is the only regulatory approval outstanding; close expected by end of Q1 2027 (10-Q filed 2026-11-05) | 2026-11-11 |
| Besi (BE Semiconductor Industries) | Packaging and assembly | Netherlands | Datacon 8800 CHAMEO ultra plus AC | — | — | — | — | 2026-11-11 |
| Camtek | Metrology and inspection | Israel | Eagle Generation-5 (Eagle G5) | — | — | — | Orders received for 2025 deliveries; launch announced 2024-09-24 | 2026-11-11 |
| Canon | Lithography | Japan | FPA-1200NZ2C | FPA-1200NZ2C: 300 | — | — | — | 2026-11-11 |
| Cohu | Test and probing | United States | Eclipse handler | — | Eclipse for GPUs, CPUs, custom AI accelerators, network processors and ASICs | — | Fourth HPC customer qualified; announcement dated 2026-11-10 | 2026-11-11 |
| Daifuku | Materials and handling | Japan | Cleanway overhead transport | — | CLW-A7 developed for larger panels and heavy loads as AI chiplet packaging advances | — | — | 2026-11-11 |
| DISCO | Packaging and assembly | Japan | DFD6363 | DFD6363: up to 300; standard 200 and 300 cassettes supported | — | — | — | 2026-11-11 |
| Ebara | Cleaning and CMP | Japan | F-REX200M2 and F-REX300X CMP; UFP-AS plating | F-REX200M2: 200; F-REX300X: 300 | — | — | — | 2026-11-11 |
| EV Group | Packaging and assembly | Austria | GEMINI FB XT | GEMINI FB: 200 and 300 | IR LayerRelease transfers ultra-thin silicon layers for 3D integration and AI/HPC chips | — | — | 2026-11-11 |
| FormFactor | Test and probing | United States | CM300xi semi-/fully automated probe system | CM300xi: 300; loader handles 200 or 300 mm wafers | — | — | — | 2026-11-11 |
| Hanmi Semiconductor | Packaging and assembly | South Korea | TC BONDER 4.5 GRIFFIN; TC BONDER 4.0 TIGER | — | HBM thermocompression bonders for AI semiconductors | Claims No.1 global HBM TC bonder position in its SEMICON Korea 2026 profile; percentage/methodology undisclosed | — | 2026-11-11 |
| Hanwha Semitech | Packaging and assembly | South Korea | SFM5-Expert thermocompression bonder; flip-chip bonders | — | — | — | — | 2026-11-11 |
| Hitachi High-Tech | Metrology and inspection | Japan | CG7300 advanced CD measurement SEM | — | — | — | — | 2026-11-11 |
| Jusung Engineering | Deposition and thermal | South Korea | SDP System; Guidance Series; Eureka | — | — | — | — | 2026-11-11 |
| KLA | Metrology and inspection | United States | 8935 patterned-wafer inspector | — | Process-control equipment serves leading-edge foundry/logic, memory and packaging investment associated with AI/HPC | — | — | 2026-11-11 |
| Kokusai Electric | Deposition and thermal | Japan | Advanced TSURUGI Plus-III mini-batch deposition platform | Advanced TSURUGI Plus-III: 300 | — | — | — | 2026-11-11 |
| Kulicke & Soffa | Packaging and assembly | United States | APTURA | — | Thermocompression chip-to-substrate equipment for AI and HPC chiplets and stacked dies | — | Bumpless chip-to-wafer hybrid bonding demonstrated with collaborators; announced 2024-08-07 | 2026-11-11 |
| Lam Research | Etch and strip | United States | Akara conductor etch | — | ALTUS Halo molybdenum ALD and Akara conductor etch support AI chip architectures | — | — | 2026-11-11 |
| Lasertec | Metrology and inspection | Japan | ACTIS A150 | — | — | — | — | 2026-11-11 |
| Mattson Technology | Deposition and thermal | United States | Helios XP and Helios C200 | Helios C200: 200 | — | — | — | 2026-11-11 |
| NAURA Technology Group | Several steps | China | NMC 612E ICP etcher; Accura LX dielectric etcher; HSE P300 deep-silicon etcher | NMC 612E: 12-inch wafers (nominal 300 mm) | — | — | — | 2026-11-11 |
| Nikon | Lithography | Japan | NSR-S636E | — | — | — | — | 2026-11-11 |
| Nova | Metrology and inspection | Israel | Nova Prism 2 | — | — | — | — | 2026-11-11 |
| Onto Innovation | Metrology and inspection | United States | Dragonfly G3 | — | Dragonfly G3 supports HBM and advanced logic packaging relevant to AI GPUs | — | Multiple orders for the new subsurface capability announced 2024-04-23 | 2026-11-11 |
| Oxford Instruments Plasma Technology | Etch and strip | United Kingdom | PlasmaPro 100 Cobra | PlasmaPro 100 Cobra: up to 200 | — | — | — | 2026-11-11 |
| Park Systems | Metrology and inspection | South Korea | Park NX-Wafer automated AFM | NX-Wafer automatic defect review: 300 | — | — | — | 2026-11-11 |
| Piotech | Deposition and thermal | China | PF-300T and VS-300T Astra PEALD; TS-300 Altair thermal ALD; Dione 300 hybrid bonder; Pleione 300 die-to-wafer fusion bonder | — | — | — | — | 2026-11-11 |
| PSK | Etch and strip | South Korea | SUPRA Vplus, N, Nm and XP | — | — | Claims largest global dry-strip share on product page; percentage and measurement year undisclosed | — | 2026-11-11 |
| PVA TePla | Materials and handling | Germany | SC-Line and CGS1218 crystal pullers | SC-Line produces silicon ingots of 200–300 mm diameter | — | — | — | 2026-11-11 |
| SCREEN Semiconductor Solutions | Cleaning and CMP | Japan | SU-3400 | SU-3400: 300 | — | Vendor claims top global share in single-wafer cleaning, batch cleaning and spin scrubbers; July 2025; no percentage disclosed | — | 2026-11-11 |
| SEMES | Several steps | South Korea | LOTUS and BLUEICE PRIME cleaners; OMEGA-S/K tracks; Michelan O3/C4 etchers | LOTUS: 300 | — | — | — | 2026-11-11 |
| SMEE (Shanghai Micro Electronics Equipment) | Lithography | China | SSX600 step-and-scan scanner; SSB800 i-line scanner; SSC800 series | SSX600: 200 or 300 | — | — | — | 2026-11-11 |
| SUSS MicroTec | Packaging and assembly | Germany | XBS300 W2W | XBS300 W2W: 200 and 300 | — | — | Supports R&D and high-volume production | 2026-11-11 |
| Teradyne | Test and probing | United States | UltraFLEXplus; Magnum 7H; ETS-800 | — | UltraFLEXplus for AI accelerators, custom ASICs and mobile SoCs | — | — | 2026-11-11 |
| Tokyo Electron | Several steps | Japan | CLEAN TRACK LITHIUS Pro DICE coater/developer | LITHIUS Pro DICE: 300 | Etch for logic/HBM interconnects; temporary wafer bonders/debonders for HBM | CY2024 worldwide: coater/developer 92%; deposition 28% (ALD 16%, CVD 38%, oxidation/diffusion 37%); dry etch 27%; cleaning 21%; wafer bonder 32%; wafer prober 38% | — | 2026-11-11 |
| TOWA | Packaging and assembly | Japan | CPM1080 Full Auto and Semi Auto systems | — | — | — | — | 2026-11-11 |
| ULVAC | Deposition and thermal | Japan | ENTRON-EXX | — | — | — | — | 2026-11-11 |
| Veeco | Deposition and thermal | United States | Spector IBD; Lumina MOCVD; WaferEtch wet processing | — | — | — | Merger with Axcelis pending; China SAMR clearance is the only regulatory approval outstanding; close expected by end of Q1 2027 (10-Q filed 2026-11-05) | 2026-11-11 |
| WONIK IPS | Deposition and thermal | South Korea | GEMINI; QUANTA; NOA; HyEta; 300series; LEVATA | — | — | Claims 50% South Korean ARC and TEOS PECVD share in its SEMICON Europa 2025 profile; methodology undisclosed | — | 2026-11-11 |
Questions buyers ask
Who are the main semiconductor equipment companies?
The table lists 48 across 10 countries. By step: ASML, Nikon and Canon for lithography; Applied Materials, ASM International, Tokyo Electron and Kokusai Electric for deposition; Lam Research, AMEC and NAURA for etch; KLA, Onto Innovation, Nova and Camtek for metrology and inspection; Advantest, Teradyne and Cohu for test. Filter the table by Process step or HQ country to narrow it.
Which semiconductor equipment makers publish market share?
Few do, and each uses its own segment. Tokyo Electron cites 92% of coater/developers in CY2024 on a Gartner-based chart. ASM International cites more than 55% of single-wafer ALD and 25% of leading-edge epitaxy in 2024 (ASM analysis and TechInsights). WONIK IPS claims 50% of South Korean ARC and TEOS PECVD. SCREEN, PSK and Hanmi Semiconductor claim the top global position in their segments without a figure. Sort or filter the Market share column to see each claim with its basis.
Which equipment companies serve AI chip production?
14 of 48 companies tie a named tool to AI, HBM or AI data-center chips in their own material, from Advantest, Applied Materials, ASML, ASMPT and Cohu and others. Use the AI-relevant tools filter to list them. Equipment for HBM stacking sits on the advanced packaging and HBM page. A blank cell means the link is not in our sources, not that none exists.
Who makes HBM and hybrid-bonding equipment?
Hanmi Semiconductor, Kulicke & Soffa, ASMPT, Besi, EV Group, SUSS MicroTec, Tokyo Electron and Teradyne sell bonders, debonders or HBM test tools. Hanmi Semiconductor lists the TC BONDER 4.5 GRIFFIN and 4.0 TIGER, Kulicke & Soffa the APTURA thermocompression platform and Besi the Datacon 8800 CHAMEO ultra plus AC hybrid bonder. See the full packaging and HBM list.
Which companies build EUV lithography tools?
ASML lists the NXE and EXE EUV systems, with 8 nm resolution on the High NA EXE. Lasertec inspects EUV masks with ACTIS tools at the same 13.5 nm wavelength, and Tokyo Electron lists a coater/developer that supports EUV including High NA. Compare them on the lithography page.
Which equipment companies use AI inside their own tools?
3 describe it: KLA (DefectWise AI), Nova (machine-learning metrology algorithms) and Cohu (PAICe Prescriptive analytics). The AI inside the equipment field covers inspection, metrology and equipment analytics, and is separate from chips made for AI.
How this table is built
Full methodologyEvery value comes from the company’s own product page, filing, investor presentation or exhibitor profile. The small number next to a figure opens that source. An empty cell means we found no source for it, and we do not estimate.
Specs are per named model, so two rows are comparable only when the unit and the metric match. Each row carries the date we last checked it, newest 11 Nov 2026. Spot a stale number? Email hello@semiconductorequipmentlist.com with the source and we update the row.
Free to reuse under CC BY 4.0 with a link to this page: CSV, JSON, llms.txt.